| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2057-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2061-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H55-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H57-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H61-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H59-0009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P3-084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P1-12 |
| filingDate |
2016-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_838c56d56b2799e446633ce16d3f938b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d68a55cd320f3d0b074693b56a40c56c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc2f4cfae5536429fe4a94b8b82672da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9b2eea21a438105609c0e5287aeef01 |
| publicationDate |
2017-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017039851-A1 |
| titleOfInvention |
Rf micro-electromechanical systems having inverted microstrip transmission lines and method of making |
| abstract |
A RF MEMS package includes a MEMS die assembly having a signal line (46) formed on a top surface of a first mounting substrate (42), the signal line comprising a MEMS device (48) selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads (52, 54, 56, 58) formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly (43) is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region (62) formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line. |
| priorityDate |
2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |