| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80948
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80004 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2016-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217ed74e20352dad365501e3881670b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c11f4241dc2866bf2fc9980b1833f06f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2746af6605dc13deeec60d445fcab903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ed8f188c97dc77bc89db1d94f52c86a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eead652160c5492c115b556b58784c8f |
| publicationDate |
2017-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017021231-A1 |
| titleOfInvention |
Method for direct bonding with self-alignment using ultrasound |
| abstract |
The invention relates to a method for the direct bonding of an electronic chip (100) onto a substrate (102) or another electronic chip, said method comprising the steps of: carrying out a hydrophilic treatment of a portion (105) of a surface of the electronic chip and of a portion (110) of a surface (108) of the substrate or of the other electronic chip; depositing an aqueous fluid (112) on the portion of the surface of the substrate or of the second electronic chip; depositing the portion of the surface of the electronic chip on the aqueous fluid; drying the aqueous fluid until the portion of the surface of the electronic chip is rigidly connected to the portion of the surface of the substrate or of the other electronic chip; said method also comprises, during at least part of the drying of the aqueous fluid, emitting ultrasound into the aqueous fluid through the substrate or the other electronic chip. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11764198-B2 |
| priorityDate |
2015-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |