| abstract |
Provided is a photocurable composition with which it is possible to suppress swelling in molds caused by resin, making it possible to improved durability of the mold, and thus leading to a photocurable composition that has excellent economic viability.　This photocurable composition contains components (A), (B), (C) and (D) below. The content of component (A) is 10-50 wt% with respect to the total amount of photocurable compounds contained in the photocurable composition. Component (A): an alicyclic epoxy compound represented by formula (a). Component (B): an oxetane compound having an Fedors SP value of at least 9.5 (cal/cm 3 ) 1/2 . Component (C): a glycidyl ether epoxy compound having a molecular weight of at least 250. Component (D): a photoinitiator. [In the formula, R 1 to R 18 are the same or different , and represent a hydrogen atom, a halogen atom, a hydrocarbon group that may contain a an oxygen atom or a halogen atom, or an alkoxy group that may have a substituent. X represents a single bond or a linking group.] |