| abstract |
Provided are: a thermosetting resin composition which exhibits particularly good compatibility, while having good dielectric characteristics (low dielectric constant and low dielectric loss tangent) in a high frequency band, high adhesiveness to a conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy; a prepreg using this thermosetting resin composition; a laminate; and a multilayer printed wiring board. The thermosetting resin composition specifically contains: (A) a polyphenylene ether derivative that has an N-substituted maleimide structure-containing group and a structural unit represented by general formula (I) in each molecule; (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds; and (C) a phosphorus flame retardant.n(In the formula, each R 1 independently represents an aliphatic hydrocarbon group having 1-5 carbon atoms, or a halogen atom; and x represents an integer of 0-4.) |