| abstract |
The present invention provides a resin impregnated material and a composite material simultaneously having excellent dielectric properties, high heat resistance, low stress properties and the like, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by general formula (I); and (B) a radical polymerization initiator. In general formula (I), X represents an aliphatic, alicyclic or aromatic hydrocarbon group, in which the number of carbon atoms in the main chain is 10 to 30; Y represents an aliphatic, alicyclic or aromatic hydrocarbon group; and n is a number in the range of 1-20. |