| abstract |
Provided is a method for manufacturing a piezoelectric element, with which peeling of an insulating layer can be minimized. This method for manufacturing a piezoelectric element comprises a first step for forming a first electrode layer, a step for forming a piezoelectric layer over the first electrode layer, a step for forming a second electrode layer over the piezoelectric layer, a step for patterning the second electrode layer, a step for patterning the piezoelectric layer by wet etching, and a step for forming an organic insulating layer on the side surface of the patterned piezoelectric layer. |