http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016136755-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2016-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d0271722e931332d0c40f717e2a06e2 |
| publicationDate | 2016-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2016136755-A1 |
| titleOfInvention | Photocurable thermosetting resin composition, cured product of same, and printed wiring board |
| abstract | Provided are: a photocurable thermosetting resin composition which has both excellent sensitivity and excellent solder heat resistance; a cured product of this photocurable thermosetting resin composition; and a printed wiring board.nA photocurable thermosetting resin composition which contains a carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A), a photopolymerization initiator (B) and an organic nitrogen compound (C). The carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A) is obtained by having a compound (A-2) partially react with a hydroxyl group of a photosensitive resin (A-1) containing a carboxyl group. The photosensitive resin (A-1) is obtained by having an unsaturated monocarboxylic acid (a2) react with an epoxy group of a polyfunctional epoxy resin (a1), and then having the reaction product react with a polybasic acid anhydride (a3) so that some of hydroxyl groups remain therein. The compound (A-2) is obtained by subjecting silane compounds including at least one silane compound having a (meth)acryloyl group to a hydrolysis-condensation reaction. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108250409-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108250409-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3979002-A4 |
| priorityDate | 2015-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 201.