| abstract |
This solder resist composition contains a carboxyl group-containing resin (A), a photopolymerizable compound (B) containing at least one kind selected from the group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator (C), a thermosetting component (D), a perylene-based black colorant (E1), and one kind of colorant (E2) other than black, the solder resist composition having such properties that the coating of the solder resist composition photocured on a copper plate and then thermoset to have any thickness within the range of 18-22 μｍ has a L ＊ value of 40 or less, an ａ ＊ value in the range of 5.1-55, and a ｂ ＊ value in the range of -15-15. |