abstract |
Provided are: a thermosetting resin composition including a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton, an epoxy curing agent (C), and a colorant (D), the thermosetting resin composition being capable of forming a cured film having an excellent balance of hardness and adhesion to glass in high-temperature conditions; and an application for the thermosetting resin composition. |