| abstract |
A thermosetting resin composition having improved performance, a dry film, a cured product and a printed wiring board are provided. This thermosetting resin composition contains (A) a bisphenol E type epoxy resin, (B) a curing agent and/or a curing accelerator, and (C) a filler. This dry film has a resin layer obtained by coating and drying the aforementioned thermosetting resin composition, this cured product is obtained by curing said dry film, and this printed wiring board comprises said cured product. |