http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016106272-A1

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filingDate 2015-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15d9131bb0dda690e9f6849b6e1e710f
publicationDate 2016-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2016106272-A1
titleOfInvention Hermetically-sealed packages including feedthrough assemblies
abstract Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.
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