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publicationDate 2016-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2016104420-A1
titleOfInvention Substrate for printed wiring board and method for manufacturing same, printed wiring board and method for manufacturing same, and resin base material
abstract The purpose of the invention is to provide a substrate for a printed wiring board having an excellent circuit formation performance while maintaining the adhesive strength between a conductive layer (2) and a base film (1). This invention is characterized in being provided with a base film (1) having an insulating property and a conductive layer (2) laminated on at least one surface of the base film (1), the maximum height Sz of the base film (1) surface as stipulated by ISO 25178 being 0.05 μm to less than 0.9 μm.
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