| abstract |
Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition has a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability. |