| abstract |
Provided is a solder resist composition comprising (A) a carboxyl-group containing resin, (B) an epoxy compound, (C) titanium oxide, (D) a photopolymerization initiator, and (E) an antioxidant. The (B) component contains a hydroquinone-type epoxy compound represented by formula (1). The (D) component contains (D1) a bisacylphosphine oxide photopolymerization initiator and (D2) an α-hydroxyalkylphenone photopolymerization initiator. |