| abstract |
Provided are: a heat-curable adhesive composition which does not undergo the bleeding out of a resin therefrom; and a heat-curable adhesive sheet.nA heat-curable adhesive composition according to the present invention, which constitutes a heat-curable adhesive sheet 20, and comprises an acrylic copolymer, a heat-curable epoxy resin, an epoxy resin-curing agent, a dendritic conductive filler 21, and a non-conductive filler 22 having an average particle diameter ranging from 3 to 15 μm inclusive. In the heat-curable adhesive composition, the fluidization of the resin component can be prevented, because the non-conductive filler 22 is entangled with the dendritic conductive filler 21. Therefore, the heat-curable adhesive composition can electrically connect a metal plate 30 to a terminal 11 while preventing the breeding out of the resin therefrom. |