http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016063696-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac04c29620822ec9f7c6f7f232a4912a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_035f220ade7116032621666e6afcdaf3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe22004a80476d89b64d0bb55b8a9836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9f8d9830a08bf30cf664c7eb2302180 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e24e769457dcbcc2e502407af5706cbf |
| publicationDate | 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2016063696-A1 |
| titleOfInvention | Metal-foil-clad substrate, circuit board, and substrate with heat-generating body mounted thereon |
| abstract | This metal-foil-clad substrate is used for forming a circuit board with a heat-generating body mounted thereon, and comprises: a flat-plate-shaped metal foil; a resin layer that has insulating properties and that is formed on one surface of the metal foil; a heat-dissipating metal plate that dissipates heat generated by a heat-generating body and that includes a section formed so as to correspond, in a planar view of the resin layer, to a first region encompassing a region where the heat-generating body is mounted on the opposite surface of the resin layer from the metal foil; and an insulating part formed so as to correspond to at least a portion of a second region on the opposite surface of the resin layer from the metal foil excluding the first region. The insulating part is constituted by a cured product of a first resin composition including a first thermosetting resin. The resin layer is constituted by a cured product or a solidified product of a second resin composition that includes a resin material and that is different from the first resin composition. The peripheral surfaces of said section of the heat-dissipating metal plate include: an exposed surface that is exposed from the insulating part; and first and second non-exposed surfaces that are not exposed from the insulating part, are connected with the exposed surface respectively at one end and the other end of the exposed surface, and satisfy a predetermined requirement. |
| priorityDate | 2014-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 124.