| abstract |
The present invention provides a dry film having excellent bending resistance, etc., and a flexible printed wiring board having a cured product of said dry film as a protective film, e.g. a coverlay or solder resist. Provided is a dry film having an adhesive surface (a1) to be pasted to an object to be protected, and having a protection surface (b1) that is positioned on the reverse side of the adhesive surface, said dry film being characterized in that, in an infrared absorption spectrum obtained using an FT-IR (Fourier transform infrared spectroscopy) ATR method (total reflection method), the adhesive surface (a1) does not have a peak ascribed to an imide but the protection surface (b1) does, and the dry film is alkali-soluble. |