| abstract |
The present invention relates to a method and measuring arrangement for layer thickness measurement of a layer which can be applied to a substrate by means of a vapour deposition method, comprising: - a measuring head (30) which is provided with at least one vibration plate (50, 52), an extraction line (12) which can be coupled in a gas or vapour conducting manner with a first end (12a) comprising a vacuum chamber (20) for the vapour deposition method and which can be coupled in a gas or vapour conducting manner with an opposite second end (12b) comprising the measuring head (30), wherein the extraction line (12) comprises at least one heating section (16) or at least one cooling section (18). |