| abstract |
Disclosed are an etching solution and an application thereof, the etching solution containing iron chloride or copper chloride, an inorganic peroxide or an organic peroxide, a weak organic acid, a weak inorganic acid or an acidic buffering agent, a complexing agent, and a sulphur-containing compound. The etching solution of the present invention is used for etching a base metal such as iron, cobalt, nickel, copper, aluminium or tin, or an alloy of said elements in the presence of a plating layer of a precious metal such as gold, silver or platinum. The etching may be performed at room temperature or a lower temperature. The brightness of the obtained etching surface is good and there is little side etching. |