| abstract |
A resin composition for temporary fixation for forming a temporary fixation material used in a method for working a semiconductor wafer, wherein: the resin composition contains (A) a thermoplastic resin, (B) a thermosetting resin, (C) a (meth)acrylic monomer, and (D) a compound from which a base and a radical are generated by radiation, the contained amount of component (D) being at least 5 parts by mass relative to 100 parts by mass of component (C); and the method for working a semiconductor wafer includes a temporary fixation step for temporarily fixing the semiconductor wafer to a support body with the temporary fixation material interposed therebetween, a working step for working the semiconductor wafer temporarily fixed to the support body, and a separation step for separating the worked semiconductor wafer from the support body and the temporary fixation material, the temporary fixation material being irradiated with radiation in the temporary fixation step. |