| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_842c1fcf03a4b5e40652cbdfda31cdd4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J13-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06 |
| filingDate |
2015-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22d308707280f50ce188368c8fbd0980 |
| publicationDate |
2016-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2016025546-A1 |
| titleOfInvention |
Electrically conductive sheet molding compound |
| abstract |
An electrically conductive fiber reinforced thermosetting resin molding compound which includes a microencapsulated curing agent is provided. Any electrically conductive fillers, including carbon fillers and metal fillers, may be used to impart electrical conductivity to the fiber reinforced thermosetting resin molding compound. |
| priorityDate |
2014-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |