http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016022755-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e786c051f83d0096a0806151b0d63ca |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-0486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B03B5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B03B5-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B07C5-342 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-018 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-018 |
| filingDate | 2015-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_559be231c95ac432dd7e2bf805925e12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cc7fcc1d45afcaf8e5d9d9a55972027 |
| publicationDate | 2016-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2016022755-A2 |
| titleOfInvention | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| abstract | Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB. |
| priorityDate | 2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.