| abstract |
The present invention relates to: a method for plating nonwoven fabric with metals (copper and nickel, or nickel and nickel) by electroless and electrolytic continuous processes; and a nonwoven fabric plated by the method. The present invention can prepare a metal-plated nonwoven fabric by electrolytic plating a space of metal ions, which are formed by performing electroless plating with copper or nickel, with nickel in a short amount of time, thereby filling up the space, and thus has excellent conductivity while being thin. A desired conductivity can be obtained by changing the composition of a plating solution or controlling the plating velocity, and a line capable of performing plating with copper and nickel, nickel and nickel, nickel alone, or copper alone, in combination, can be manufactured. In addition, a highly conductive nonwoven fabric having no difference in plating thickness of nonwoven fabric performed by only electroless plating can be produced. |