http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016010252-A1

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publicationDate 2016-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2016010252-A1
titleOfInvention Adhesive composition, anisotropic conductive film, and semiconductor device using same
abstract The present invention relates to: an adhesive composition containing a cycloaliphatic epoxy resin, of which the heating peak temperature by thermal differential scanning calorimetry is 60°C to 105°C, a cationic polymerization catalyst of chemical formula 1, and a compound of chemical formula 2; an anisotropic conductive film using the same; and a semiconductor device connected by the anisotropic conductive film.
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