abstract |
The present invention relates to: an adhesive composition containing a cycloaliphatic epoxy resin, of which the heating peak temperature by thermal differential scanning calorimetry is 60°C to 105°C, a cationic polymerization catalyst of chemical formula 1, and a compound of chemical formula 2; an anisotropic conductive film using the same; and a semiconductor device connected by the anisotropic conductive film. |