| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-1545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-1515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a40e60cd6ee22a270998f88d439773fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c52d5bf537499184d6674663714d596
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73c8ae494b17ab4ff5cb85b3568fb97 |
| publicationDate |
2016-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2016002241-A1 |
| titleOfInvention |
Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article |
| abstract |
To provide: an epoxy resin composition which has excellently low thermal expansion, excellently low moisture absorption and high heat resistance, and which provides a cured product that is small in volume change after thermal history; a curable resin composition; a cured product that has all of the above-described properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article.nThe present invention is an epoxy resin which is characterized by containing, as essential components, (A) a cresol-naphthol co-condensed novolac epoxy resin, (B) a glycidyl ether compound of naphthol, and (C) one or more xanthene compounds selected from the group consisting of compounds represented by one of formulae (1)-(3), and which is also characterized in that the content ratio of the xanthene compounds (C) as determined by GPC measurement is 0.1-5.5% in terms of area ratio. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023079361-A1 |
| priorityDate |
2014-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |