| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2800-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F12-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L35-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F4-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F4-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L35-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 |
| filingDate |
2015-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efefc40623452be3accf7942214044a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fca3bb4903815d2465cd04ce8233871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40810becdc20c40aa6a9660a0b9db15a |
| publicationDate |
2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015190224-A1 |
| titleOfInvention |
Resin composition and electric device |
| abstract |
The present invention addresses the problem of providing an excellent heat-curable resin which has a reduced viscosity and is improved in both heat resistance and toughness or mechanical strength required for improving cracking resistance which have had a trade-off relation to each other previously. The present invention also addresses the problem of providing an electronic or electric device in which a cured article produced using the heat-curable resin is used as an insulation material or a structural material. The present invention involves multiple types of means for solving the problems. One embodiment of the means is characterized by being a heat-curable resin composition which comprises: a three-dimensional copolymer produced by copolymerizing a maleimide derivative with a styrene derivative using an alkylborane or a boron compound as a polymerization initiator; and a heat-curable resin composition. |
| priorityDate |
2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |