| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_943ce8b5eab241d0469c8cbcbcd3dbce |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2015-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98e50fb9bc725ea1e111f065220581a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6d7569b1ae0c1b428f319342f88cc96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4928eb7812f2f699049246af8c669991 |
| publicationDate |
2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015178258-A1 |
| titleOfInvention |
Printed wiring board and method for manufacturing printed wiring board |
| abstract |
The objective of the present invention is to provide a printed wiring board wherein conductive layers formed on both surfaces of a base layer that is mainly composed of a fluororesin are reliably connected by a via hole. A printed wiring board according to one embodiment of the present invention is provided with: a base layer that is mainly composed of a fluororesin; a first conductive layer that is laminated on one surface of the base layer; a second conductive layer that is laminated on the other surface of the base layer; and a via hole which is formed along a connection hole that penetrates the base layer and the first conductive layer and/or the second conductive layer in the thickness direction, and which electrically connects the first conductive layer and the second conductive layer with each other. At least a part of the inner circumferential surface of the base layer in the connection hole is provided with a pretreated surface that has a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic% or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109892022-A |
| priorityDate |
2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |