| abstract |
The objective of the present invention is to provide a photo- and moisture-curing resin composition that has excellent adhesiveness and reliability in a high temperature/high humidity environment. The objective of the present invention is also to provide an adhesive for electronic parts and an adhesive for a display element which are made using the photo- and moisture-curing resin composition. This photo- and moisture-curing resin composition includes a radical polymerizable compound, a moisture-curing urethane resin, and a photo-radical polymerization initiator, wherein the moisture-curing urethane resin includes a compound having an urethane bond, a group represented by formula (1), and an isocyanate group. In formula (1), R 1 and R 2 are a hydrogen, an alkyl group having 1 to 5 carbon atoms, or an aryl group, and R 1 and R 2 may be the same or different, and x is 0 to 2. |