| abstract |
Provided are: a curable organopolysiloxane composition which exhibits an excellent improving effect on initial adhesive properties with respect to a variety of base materials, and which, when cured, achieves particularly excellent adhesive durability and high adhesive strength; and a protective-agent or adhesive-agent composition for electrical/electronic components. The curable organopolysiloxane composition includes: (A) either an organopolysiloxane (a1) having a specific alkoxysilyl-containing group and at least 0.5 alkenyl groups on average, or a mixed substance comprising component (a1) and an organopolysiloxane (a2) which has at least two alkenyl groups per molecule, and which does not have the specific alkoxysilyl-containing group (in the mixed substance, the content of component (a1) is at least 10 mass%, but less than 100 mass%); (B) an organopolysiloxane which has at least two silicon-atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and (D) a condensation reaction catalyst. |