http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015144319-A1

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2a9477fa547774350cb8ec4b9ca87477
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-0014
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2015-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8238b456c92824c19ed9da518372845
publicationDate 2015-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2015144319-A1
titleOfInvention Method for coating cavities of a semiconductor substrate
abstract The invention relates to a method for temporarily coating cavities (2), with which a semiconductor substrate (1) is at least partially interspersed and which are intended for a permanent coating and/or component mounting, with a temporarily applied coating material (3) before processing steps for processing at least one surface (1o) of the semiconductor substrate (1). The invention further relates to a method for removing a temporary coating from cavities (2) of a semiconductor substrate (1), wherein the coating has been or is applied according to an aforementioned method and wherein thereafter, in particular immediately thereafter, a permanent coating and/or component mounting of the cavities (2) occurs.
priorityDate 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 28.