| abstract |
The present invention addresses the problem of reducing the temperature of a heat-emitting electronic component and causing fewer heat spots without changing the design of the structure of a substrate, and extending the time until the function of an electronic terminal device is limited. In an electronic terminal device substrate (14) of this electronic terminal device, said substrate (14) having on at least one surface heat-emitting electronic components (13a, 13b) and electromagnetic shield members (12a, 12b) adjacent thereto and attached so as to cover from the top surfaces thereof, the space between the electromagnetic shield members (12a, 12b) and the substrate (14) is filled with a thermally conductive curable liquid resin so as to come into contact with the heat-emitting electronic components (13a, 13b), and the liquid resin is cured. Furthermore, a high-thermal-conductivity resin film (15a, 15b) for dispersing the heat drawn up by the thermally conductive curable liquid resin is disposed in contact with the top surface (12d) of the electromagnetic shield members (12a, 12b), or facing said top surface (12d). |