| abstract |
The present invention relates to a curable composition for optical semiconductor devices, which provides a cured product with good mechanical property, barrier property, heat resistance and light resistance. The curable composition comprises: a) at least one organic compound having two or more carbon double bonds which is represented by formula (1). wherein R 1 at each occurrence independently from each other represents a monovalent organic group having 1 to 20 carbon atoms, b) at least one silicon hydride compound comprising at least two hydrogen atoms each directly bonded to a silicon atom and at least one aryl or arylene group per molecule, and c) at least one hydrosilylation catalyst. The present invention further relates to the use of the curable composition in production of an optically semiconductor device. |