| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1fb5c3c353cf699c90425f9b4b36c838 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2560-0214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-14532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02C7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-1477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B3-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-6821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-1486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-14507 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02C7-04 |
| filingDate |
2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bc4b90c104b3bb708525bd434da6f6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_daf7c6c6fca419e4d4fb5c7f3767bdb8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01499bfbdac5ea50ac59a5e9be765502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e8eb282027ae9e1083f19493e84eebf |
| publicationDate |
2015-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015100266-A1 |
| titleOfInvention |
Molded electronic structures in body-mountable devices |
| abstract |
Molded electronic structures configured for use in body-mountable devices and methods for embedding molded electronic structures in a body-mountable device are described. An example method may include molding an electronic structure to have first curvature corresponding to a first radius of curvature. The electronic structure may include an antenna, a sensor, and an electronic device. The example method may also include adhering the molded electronic structure to a first polymer layer. The example method may additionally include forming a second polymer layer over the molded electronic structure adhered to the first polymer layer. |
| priorityDate |
2013-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |