| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6a73440018eca5d3e92ae110c26dbb1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0655 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L85-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G79-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4028 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L85-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2013-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe18259519c202041d503bbee55e81ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a194bbc072d8b680172101ba8d84fae |
| publicationDate |
2015-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015096122-A1 |
| titleOfInvention |
Thermosetting resin composition and use thereof |
| abstract |
The present invention relates to a thermosetting resin composition, comprising: (A) epoxy resin having a naphthol structure on the molecular main chain thereof; (B) a cyanate compound and/or a cyanate prepolymer; (C) poly-phosphonate and/or a phosphonate-carbonate copolymer. The thermosetting resin of the invention has a low dielectric constant and dielectric loss tangent. Prepregs and copper clad laminates thereof made from the thermosetting resin composition have excellent dielectric properties and moisture and heat resistance, with flame retardancy reaching grade UL94 V-0, and have good machinability. |
| priorityDate |
2013-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |