abstract |
The present invention relates to a thermosetting resin composition, comprising: (A) a cyanate compound and/or a cyanate prepolymer; (B) poly-phosphonate and/or a phosphonate-carbonate copolymer. The thermosetting resin composition of the invention has a low dielectric constant and dielectric loss tangent. Prepregs and copper clad laminates made from the thermosetting resin composition have excellent dielectric properties and moisture and heat resistance, with flame retardancy reaching grade UL94 V-0, and have good machinability. |