| abstract |
In this optical semiconductor device provided with a metal lead frame and a reflector formed in a manner so as to encircle the periphery of an optical semiconductor element mounted on the metal lead frame, the reflector-forming material is an epoxy resin composition that is for an optical semiconductor device and that contains an epoxy resin (A), a curing agent (B) having a liquid curing agent as the primary component, zirconium oxide (C), a silane-based compound (D), and an inorganic filler (E), the total content of (C) and (E) being 70-90 vol% of the entire epoxy resin composition and the content of (D) being 0.1-8 wt% of (C). As a result, a reflector is obtained that is provided not only with high initial light reflectance, but also superior long-term light resistance and also a high glass transition temperature. Consequently, the optical semiconductor device in which the reflector is formed using the epoxy resin composition for an optical semiconductor device has high reliability. |