http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015064163-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2014-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66eef508ba68bb11b830dba019b52258 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f27808cdbccbc0fc0bc792074374c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae233ec4f9cff125dc4a41ddcd5aa4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76a5fe3304e5f90cfa2b2bde76c58f28 |
| publicationDate | 2015-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2015064163-A1 |
| titleOfInvention | Photosensitive thermosetting resin composition and flexible printed circuit board |
| abstract | Provided is a photosensitive thermosetting resin composition that has excellent reliability with respect to, for instance, impact resistance or flexibility, as well as excellent machining precision and manufacturability, and is ideal for package molding of an insulating film , particularly the bending parts (flexible parts) and mounted parts (inflexible parts) in a flexible printed circuit board. The photosensitive thermosetting resin composition is characterized by including an alkali-soluble resin having imide rings, an alkali-soluble resin other than an alkali-soluble resin having imide rings, a photobase generator, and a thermosetting component. The structure of the other alkali-soluble resin preferably has at least one selected from a urethane bond, a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, and a biphenyl skeleton. |
| priorityDate | 2013-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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