| abstract |
The present invention relates to a support pad wherein the low P compressibility, which is a ratio of the difference, between a first thickness measured by applying pressure of 5 g/㎠ to the thickness direction of the support pad and a second thickness measured by applying pressure of 100 g/㎠ to the thickness direction of the support pad, to the first thickness, is 1-10%, and wherein the low P compressed length, which is the difference between the first thickness and the second thickness, is 15-100 ㎛. According to the present invention, it is possible to provide a polyurethane support pad which has high compressibility and excellent elasticity in actual polishing conditions and implements more uniform and efficient polishing, thereby being capable of reducing polishing defects. |