http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015047970-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-06 |
filingDate | 2014-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_211baa1589c34f45f1a3109b339a3a88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c57c30eb250e884628498fa786a01934 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39c6e73983b7b0926d6cf54503db1b93 |
publicationDate | 2015-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2015047970-A1 |
titleOfInvention | Chemical-mechanical planarization of polymer films |
abstract | The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a substrate with the chemical-mechanical polishing composition. The polishing composition comprises (a) abrasive particles that comprise ceria, zirconia, silica, alumina, or a combination thereof, (b) a metal ion that is a Lewis Acid, (c) a ligand that is an aromatic carboxylic acid, an aromatic sulfonic acid, an aromatic acid amide, an amino acid, or a hydroxy-substituted N heterocycle, and (d) an aqueous carrier, wherein the pH of the chemical-mechanical polishing composition is in the range of 1 to 4. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017190413-A |
priorityDate | 2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.