| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03K17-962
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B17-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03K17-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 |
| filingDate |
2014-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_318e6d8d140c03f1cbe84718b170484d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7d0a82d2d1eb98a8631a9954c434e72 |
| publicationDate |
2015-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015017489-A1 |
| titleOfInvention |
Thermally conductive dielectric for thermoformable circuits |
| abstract |
This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process. |
| priorityDate |
2013-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |