| abstract |
Provided are a photocuring composition having exceptional curing properties, and a cured material obtained by curing thereof. This photocuring composition for printed circuit boards contains: at least one photopolymerization initiator selected from the group consisting of oxime ester based photopolymerization initiators, alkyl phenone based photopolymerization initiators, acyl phosphine oxide based photopolymerization initiators, and titanocene based photopolymerization initiators; and a photopolymerization initiator represented by the following general formula (I). (In formula (I), R represents a structure indicated by the following formula (II), l 1 is an integer from 2 to 4, inclusive, and m 1 is an integer equal to 1 or greater.) |