| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C39-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C37-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-12 |
| filingDate |
2014-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f4a4e497cd21df54d782548ce389362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c52d5bf537499184d6674663714d596 |
| publicationDate |
2014-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014199662-A1 |
| titleOfInvention |
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board |
| abstract |
Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame retardance of the cured product thereof; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The compound containing a phenolic hydroxyl group is characterized by having a molecular structure represented by general formula (I) [in the formula: X is a structural site represented by structural formula (x1) or (x2) {in formula (x1) and (x2), k is an integer from 1 to 3, m is 1 or 2, and Ar is a structural site represented by structural formula (Ar1) (in the formula, p is 1 or 2). When k or m is 2 or greater, the plurality of Ar may be the same or different}]. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7306790-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016113549-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016113581-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017038968-A1 |
| priorityDate |
2013-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |