Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C39-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C37-14 |
filingDate |
2014-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5444629ed2d04c52ce4b8346c3a0b05d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f4a4e497cd21df54d782548ce389362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c52d5bf537499184d6674663714d596 |
publicationDate |
2014-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2014199661-A1 |
titleOfInvention |
Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board |
abstract |
Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame retardance of the cured product thereof; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The phenolic resin is characterized by containing, as required components, a binuclear compound (X) represented by structural formula (I) [in the formula: j and k are each 1 or 2; and at least one of j and k is 2] and a trinuclear compound (Y) represented by structural formula (II) [in the formula: l, m, and n are each 1 or 2; and at least one of l, m, and n is 2]. |
priorityDate |
2013-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |