| abstract |
The invention relates to a method for adhesively bonding two substrates by means of an adhesive film that can be made to bond adhesively by being activated with heat, wherein - the adhesive film is not adhesive at room temperature, - in a first step the adhesive film is laminated in a heated state onto the first of the substrates to be adhesively bonded, - after the lamination, the side of the adhesive film that is not in contact with the first substrate to be adhesively bonded is initially exposed, in order to be able to be brought into contact with the second substrate to be adhesively bonded, characterized in that - the adhesive film is activated by irradiating with electromagnetic radiation in the near infrared range (NIR), by heating to a temperature T K above the lowest activation temperature T A,u , and the adhesive bonding with the second substrate to be adhesively bonded is brought about by means of the activation by the NIR radiation. |