| abstract |
In order to maintain an airtight state inside a surface acoustic wave device in an environment having temperature variation, even if thermal stress is generated, the surface acoustic wave device (1): comprises a piezoelectric substrate (11), a dielectric film (12), IDT electrodes (13, 14), and a resin member (15); and has a resin contact area (RC) wherein the piezoelectric substrate (11) and the resin member (15) come in direct contact. The resin contact area (RC) is formed so as to surround the IDT electrodes (13, 14). The resin member (15) has a large adhesive force relative to the piezoelectric substrate (11), thereby peeling between the piezoelectric substrate (11) and the resin member (15) can be suppressed and an airtight state inside the surface acoustic wave device (1) can be maintained. |