| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0776
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81411
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-381 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cff3957f06de3fab5707ae7e10d52cb |
| publicationDate |
2014-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014168175-A1 |
| titleOfInvention |
Method for manufacturing soldering circuit board, soldering circuit board, and method for mounting electronic component |
| abstract |
The present invention is a method for manufacturing a soldering circuit board and is characterized by carrying out in this order: a resist forming step for partially covering a conductive circuit electrode surface on a printed wiring board with a resist; an adhering part forming step that forms an adhering part by imparting adhesiveness to parts that are not covered by the resist on the conductive circuit electrode surface; a solder attachment step for attaching solder powder to the adhering part; a resist removal step for removing the resist; and a first heating step that heats the printed wiring board and melts the solder powder. |
| priorityDate |
2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |