| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1067 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2014-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_861004cbbd8e893d486c707f55ffafc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ba7b215ff6ec205b4a61d9c5a69209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47a111168c8b618bd6b9b78cceed8289
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d1a9f53b3909fe4bff7091e85364e5e |
| publicationDate |
2014-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014157228-A1 |
| titleOfInvention |
Composition, cured product, stacked body, production method for underlayer film, pattern formation method, pattern, and production method for semiconductor resist |
| abstract |
Provided is a composition with which an underlayer film can be provided, said underlayer film exhibiting excellent adhesive properties between an imprint layer and a substrate, excellent in-plane uniformity with respect to film thickness, and a low defect density. This composition includes a polymerizable compound, a first solvent, and a second solvent. The boiling point of the first solvent at 1 atmosphere is at least 160˚C. The boiling point of the second solvent at 1 atmosphere is less than 160˚C. The content of the polymerizable compound in the composition is less than 1 mass%. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018046081-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10571802-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101947300-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170094371-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7199510-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020184497-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10520814-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020184497-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108351593-A |
| priorityDate |
2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |