| abstract |
Provided is a composition for forming a conductive film, said composition containing: copper oxide particles (A) having an average particle size of 50-500 nm; at least one copper complex (B) having a molecular weight of 1000 or less selected from the group consisting of copper formate, and a salt of copper and acetone dicarboxylic acid or a derivative thereof; and a thermoplastic polymer (C). The composition has a copper complex (B) content of 5-30 mass% of the total mass of the copper oxide particles (A), and is capable of forming a conductive film that exhibits excellent adhesion to a substrate, and high conductivity (low resistance). Also provided is a conductive film manufacturing method using the composition. |