| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K2102-331 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2014-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bacbc6eb6995ecee57a38ade9fddb75c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36844556e1623bd1ca3dd322ef9f2f67 |
| publicationDate |
2014-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014126034-A1 |
| titleOfInvention |
Photosensitive resin composition for inkjet application, heat-treated substance, manufacturing method therefor, resin-pattern manufacturing method, liquid-crystal display, organic electroluminescent display, touch panel, manufacturing method therefor, and touch-panel display |
| abstract |
The purpose of the present invention is to provide a photosensitive resin composition that exhibits excellent inkjet discharge properties and storage stability, dries rapidly, and after heat treatment, is highly transparent. This photosensitive resin composition for inkjet application is characterized by containing the following: inorganic particles (component A); a solvent (component B); a polymer (component C) containing a constitutional unit that has a group in which an acid group is protected by an acid-degradable group; and a photoacid generator (component D). This photosensitive resin is further characterized in that component B contains a non-alcohol solvent that has a boiling point between 177°C and 227°C, inclusive, and an I/O value between 0.50 and 1.00, inclusive. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7059632-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020179877-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018047688-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11401461-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017016116-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019026810-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019026809-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019026811-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020179876-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11479510-B2 |
| priorityDate |
2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |