| abstract |
Disclosed is a curable composition comprising: a silicone (A) having a Si-OH group and a Si-H group and having a specific structure and a specific chemical composition; a silicone (B) having a Si-OH group and a Si-CH=CH 2 group and having a specific structure and a specific chemical composition; and a catalytically effective amount of a hydroxysilylation catalyst comprising at least one metal compound selected from the group consisting of a platinum compound, a palladium compound and a rhodium compound. In the curable composition, the types of the silicones and the amount of a Si-OH group are adjusted. Therefore, during the curing of the silicones, the occurrence of a dehydrative condensation reaction between Si-OH groups can be prevented in a hydroxysilylation reaction in which a Si-CH=CH 2 group is reacted with a Si-H group, and consequently the formation of bubbles in a cured product can be prevented. In addition, when the composition is cured into a film, excellent adhesion of the film to a base such as a semiconductor substrate can be achieved. |